Circuit board plate classification, distinction between advantages and disadvantages
The main criteria for substrate materials:
National standards: China's national standards for substrate materials GB / T4721-47221992 and GB4723-4725-1992, China Taiwan's copper clad plate standard for the CNS standard, is based on the Japanese JIs standard modeled, published in 1983 The
International standards: Japan's JIS standards, the United States ASTM, NEMA, MIL, IPc, ANSI, UL standards, the British Bs standards, Germany DIN, VDE standards, France's NFC, UTE standards, Canada CSA standards, Australia's AS Standards, the former Soviet Union's FOCT standards, international IEC standards.
Circuit board plate classification:
FR-1: flame retardant copper foil phenolic paper laminate. IPC4101 detailed specification number 02; Tg N / A.
FR-4:
Flame Retardant Copper Foil Epoxy E Glass Fiber Cloth Laminate and Its Adhesive Sheet Material. IPC4101 detailed specification number 21; Tg ≥ 100 ℃;
Flame Retardant Copper Foil Modified or Unmodified Epoxy E Glass Fiber Cloth Laminate and Its Bonded Sheet Material. IPC4101 detailed specification number 24; Tg 150 ° C to 200 ° C;
Flame Retardant Copper Foil Epoxy / PPO Glass Cloth Laminate and Its Adhesive Sheet Material. IPC4101 detailed specification number 25; Tg 150 ° C to 200 ° C;
Flame Retardant Copper Foil Modified or Unmodified Epoxy Glass Cloth Laminate and Its Bonded Sheet Material. IPC4101 detailed specification number 26; Tg 170 ℃ ~ 220 ℃;
Flame Retardant Copper Foil Epoxy E Glass Cloth Laminate (for Catalytic Addition). IPC4101 detailed specification number 82; Tg N / A; 94vo-cem-1.
Good and bad distinction: meet the standard for the excellent, do not meet the specifications for the poor.
