An encapsulant is typically applied to a solar silicon wafer through a process called lamination. This involves placing the wafer between two layers of encapsulant material, such as EVA (ethylene-vinyl acetate), and then subjecting it to heat and pressure. The heat melts the encapsulant, enabling it to bond with the wafer, while the pressure ensures uniform distribution of the material and helps to remove any air bubbles. This lamination process provides protection to the solar silicon wafer from environmental factors and enhances its durability and performance.
An encapsulant is typically applied to a solar silicon wafer by using a lamination process. This involves placing the wafer between two layers of encapsulant material and subjecting it to heat and pressure. The encapsulant material melts and spreads evenly, creating a bond between the wafer and the encapsulant layers. Once cooled, the encapsulant solidifies, providing protection and insulation to the solar silicon wafer.
An encapsulant is typically applied to a solar silicon wafer by using a process called lamination. In this process, a layer of encapsulant material, usually ethylene-vinyl acetate (EVA), is placed between the silicon wafer and a top layer of glass. The wafer, encapsulant, and glass are then sandwiched together and subjected to heat and pressure. This causes the encapsulant to melt and flow, adhering to the wafer and creating a protective layer that encapsulates the solar cells.
