How to extract silicon from silicon wafers
Chamfer: the annealed silicon wafer is trimmed into an arc shape, which can prevent the wafer edge from cracking and lattice defect, and increase the flatness of the epitaxial layer and the photoresist layer. In this process, the silica fume is produced by water leaching to produce waste water and silicon slag. [1]
Annealing: double position hot oxidation furnace after nitrogen purging, infrared heating to 300~500 DEG C, silicon wafer surface and oxygen react, so that the surface of silicon dioxide protection layer.
Slice: cut a single crystal silicon rod into a thin wafer with an exact geometry. In this process, the silica fume is produced by water leaching to produce waste water and silicon slag.
