How to make the photoresist and silicon substrate adhesion better
PR and the same solvent for the HMDS can be better combination, adhesion will be better, will not produce bubble. You can search the TOK OAP material. That's what it's supposed to be
A thin layer of HMDS (hexamethyldisilazane) can be applied on the bottom layer of the silicon wafer, and then coated with PR, the main function of the solvent is to make the surface structure of the SIO2 of the silicon chip to be changed from hydrophilicity to hydrophobicity
By the way, if there is a reflection of the bottom, then you need to coat a layer of BARC, and then at coat PR.Hope can help you.
