LED package and LED SMD LED lamp, what is the difference? Will the release agent be used in that part?
Mold release agent is a functional substance between the mold and the finished product. The release agent is chemically resistant and is not soluble in contact with the chemical constituents of different resins (especially styrene and amines). Release agent also has heat and stress properties, not easy to decompose or wear; release agent bonded to the mold, and not transferred to the processed parts, without prejudice to painting or other two processing operations. Because of the rapid development of injection molding, extrusion, calendering, molding and laminating, the dosage of mould release agent is greatly improved.
They differ in form and belong to the SMDLED category. Encapsulation uses liquid silicone and epoxy resins as well. The patches are basically made of epoxy resin. Relatively speaking, the amount of liquid silica should be relatively large.
Packaging is for TOP series LED, that is, the type of plastic molding. The patch is based on the PCB circuit board for molding. Mold release agent is used in molding.
