The meaning of various namesOften heard: low resistance, high resistance, Dummy, wafer, and heavily doped wafer coating film, head of tailing, baffle.Many sayingWhat's the meaning? What's the difference?Please DX me
Need some wafer to test the state of the art production equipment, such as particle, etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used to group together with the normal production process to test the quality condition of a process, such as the CVD film thickness. Production equipment in the maintenance or repair immediately after. Production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, this type of wafer is called dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as certain machine wafer must process to a certain number the problem with dummy wafer. And some machine must be a form of dummy run in the process of a certain number of wafer, otherwise the process can not guarantee the quality and so on and so on many of the wafer are Dummy. can be called a wafer chip can be basically regarded as a dummy.Dummy wafer, control, block and so on are usually recyclable
Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough wafer in doping some impurities, such as P, B and so on, to change its resistance, thus had low resistance, high resistance, heavily doped term coated can be understood as the extension of Epi, according to the specific requirements of the device semiconductor is made of wafer, is usually used in high-end IC and special IC, such as Si on insulator (SOI). In the production process of IC wafer
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer is produced
