What are ceramic CCL? Power electronics?
Application of ceramic CCLEnergy saving control of household appliancesEnergy saving control of industrial electricTransportation of new energy industries, such as wind energy and solar energyNew solar panelDCB characteristic parametersItem name, unit test, condition parameterThe insulation resistance is greater than or equal to 1 M.Insulation voltage of VAC (.RMS) 1min = 3000The tensile strength of kN/cm2 = 5Peel strength of N/mm = 6The thermal conductivity is W/m.k, room temperature is 20, 24~28The thermal expansion coefficient of 1 * 10-6/ 50 DEG to 200 DEG C = 7.4Suit temperature range -40 to +200 centigradeHydrogen embrittlement at temperature 400DCB flatness tolerance valueDCB diagonalLength L (mm) 200~250150 to 200110~15080 to 11060~8040 to 6020~40 < 20Tolerance value (mm) = 1 = 0.8 = 0.6 = 0.4 = 0.2 = 0.1 = 0.05 = 0.03Characteristic parameters of ceramic substrateItem name, unit test, condition parameterThe content of Al2O3% = 96Insulation voltage kV/mm = 12A dielectric constant of 25 DEG 1MHz = 9.2The dielectric loss angle tangent 1MHz 25 degrees less than 3 * 10-4The thermal conductivity of W/m.k at room temperature 20 C = 22The thermal expansion coefficient of 1 * 10-6/ 20 DEG to 500 DEG C = 6.7The density of g/cm3 = 3.7
Ceramic laminate, English Name: Direct Bonding Copper English, abbreviated as DBC or DCB, refers to a kind of composite material with high thermal conductivity and electrical, copper foil in an inert gas and ceramic substrate by high temperature melting and diffusion process and the formation of high dielectric strength. In the power electronics industry, relying on this material has developed a module packaging chip interconnection technology, driving power electronic products toward high power density, multi-function sets, high-performance, low-cost direction.Advantages of ceramic ccl:The copper foil and ceramic are directly combined with good thermal conductivity. The thermal conductivity of alumina -DBC is 24~28 W/ (mK), and AlN-DBC is 170~220 W/ (mK).The stability of the ceramic substrate makes DBC excellent insulation performance under various conditions.The thermal expansion coefficient near the silicon allows the semiconductor chip to be welded to withstand stress shocks caused by temperature changes, thereby substantially prolonging the lifetime of the semiconductor product.Like PCB can easily processing all kinds of graphics and lines, strong current conduction ability, so that power electronic products easily realize on-board chip interconnection function, the highest ampacity of up to 100 amperes / mm.The above information comes from the bad ball information network, hoping to resolve your doubts.
