What is a silicon wafer cutting edge material?
Because the cutting edge material particles have very sharp edges, and the hardness is far greater than the silicon rod or silicon ingot hardness, so the silicon rod or silicon ingot and steel wire contact area gradually by the cutting edge material particle grinding off, so as to achieve the purpose of cutting.
Online cutting process, the cutting fluid (usually polyethylene glycol) and cutting edge material sand spray with the fall in thin steel wire by thin steel wire net, high speed, make the mortar in cutting edge material and pressed online silicon rod or a silicon ingot surface high speed grinding,
The cutting edge of silicon wafer is the cutting edge of the cutting machine. The utility model is mainly used for cutting silicon wafer and semiconductor wafer, and is one of the three consumable materials of silicon wire cutting at present
