What is the cutting fluid for solar wafer cutting?
MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
Because in the China multi wire cutting machine was first used in semiconductor cutting, so that only the Swiss MB and HCT, the Swiss system thinking line cutting machine with special emphasis on power and environmental protection, so that this kind of machine in the cutting process of mortar viscosity requirement is relatively high, the most direct embodiment is to use the cutting fluid is oily, reflected in the raw material cutting fluid is used to peg, otherwise, the power will be the formation of excess waste machine. NTC is the rise in the solar industry on the occasion, we seize the opportunity, to imitate the Swiss line cutting machine design and production, but the Swiss precision machine modified to virtually out of order, the rapid development of the pursuit of efficiency of solar wafer cutting industry, especially to the rise of China solar wafer cutting industry thus, China quickly occupied the market leader, the share reached 65%. However, the company has done a little better, although the power system and the power of the machine to reduce a lot, you can use the machine in the use of cutting fluid on the Swiss machine standards. Oily cutting fluid cutting efficiency and surface cut out of the film is generally better than the aqueous solution of cutting fluid, but the performance of Japanese light wire cutting machine, which he used oily fluid will cause a burden on his power, so Japanese developed this kind of water-based cutting fluid. Regardless of the cost or the use of the Japanese machine are more consistent, and easy to recycle. This NTC machine oil cutting fluid and water-based cutting fluid can be used.
Solar wafer cuttingThe nine day of the moon is 1 | browse 4555Posted on 2011-03-08 14:06 best answerWire cutting equipment in Sweden, Japan, and domestic equipment;Sweden's MB and HCT devices are a little better;B, HCT, NTC and Ernst & Young wire cutting machine in the silicon wafer cutting silicon wafer cutting fluid and mortar requirementsLabel: cutting machine wire cutting machine silicon solar energyIn recent years, Chinese solar wafer cutting industry booming in Japan in 2008, another solar wafer multi wire cutting machine brand - Ernst & young, also started in the domestic debut, and big cost savings card, that technology has many advantages, more advanced. However, from the point of view of the effect of the use of domestic users, and NTC and MB and HCT in Switzerland, Ernst & Young in China there is a clear case of acclimatized.
