What ‘s the thickness of a piece of aluminum substrate copper foil?
Aluminum substrate is made of circuit layer (copper layer), insulating layer and metal substrate. Circuit layer requires high current-carrying capacities, so thicker copper(35μm-280μm) is used .
High performance products as IMS-H01, IMS-H02 and LED-0601 are using this core technology, having good thermal and electric insulation. Metal substrate is supporting elements that require high thermal conductivity. It is aluminum or copper sheet (the latter has better thermal conductivity), suitable for ordinary mechanical process as drilling, punching shear and cutting.
Gold-plating, hot air leveling, OSP anti-aging, immersion gold, and unleaded ROHS process. Substrate: aluminum substrate Properties: thin insulation layer, low thermal resistance; nonmagnetic; good heat dissipation; highly-mechanized products. Standard thickness: 0.8、1.0、1.2、1.5、2.0、2.5、3.0mm Copper thickness: 1.8um35um70um105um140um Features: good heat dissipation and electro-magnetic shielding, processing abilities Uses: LED-dedicated power hybrid IC (HIC).
Aluminum substrate copper foil is negative electrode materials, a series of thin tinsel deposited at the base of the circuit board as an electric conductor. It easily bonds with the insulating layer under the protection of printing layer, turning into circuit patterns.
0.10mm the minimum clearance; 0.15mm the minimum hole diameter; 0.025mm copper thickness; ±0.05m PTH hole tolerance; ±0.05mm non PTH hole tolerance; ±0.076mm hole position deviation; ±0.1mm outline tolerance.
