For solar wafer cutting diamond wire, what are the characteristics?
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume.3, can only be used for single crystal cutting.4, the cost problem. Now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive.
The diamond wire saw is referred to as diamond wire, diamond wire, are the different names of one thing, because it is the thread sawing, all wire - sometimes called is a steel wire electroplating a layer of diamond particles consolidation.
There are several kinds of electroplated diamond wire, resin bonded diamond wire and mechanical pressing diamond wire. The general application of electroplating diamond wire is mainly due to its good wear resistance and heat resistance, diamond particles are not easy to fall off.Advantages: 1. Compared with the free abrasive cutting, the diamond wire cutting has a higher grinding speed, that is, higher production efficiency.2, silicon wafer yield is higher.3, cutting fluid consumption less, can reduce environmental pollution problems.Disadvantages: 1, the silicon wafer surface has obvious line, to see whether the customer can accept.
