Solar silicon wafers are typically cut from a silicon ingot using a wire saw or a diamond-blade saw. The ingot is first sliced into thin wafers using a wire saw that consists of a continuous loop of wire with diamond particles. The wire saw is guided through the ingot, creating multiple wafers simultaneously. Alternatively, a diamond-blade saw can be used, which involves cutting the ingot into wafers with a rotating blade coated with diamond particles. Both methods ensure precise and clean cuts, resulting in the formation of individual solar silicon wafers.
Solar silicon wafers are typically cut from a silicon ingot using a process called wire sawing. In this method, a wire made of a hard and abrasive material, such as diamond, is used to slice through the ingot. The wire is guided by a set of pulleys and continuously fed with a slurry mixture of silicon carbide and water to aid in the cutting process. As the wire moves through the ingot, it gradually separates it into thin wafers, which can then be further processed and used in the production of solar cells.
Solar silicon wafers are cut from a silicon ingot using a process called wafering. This involves several steps including slicing, lapping, and polishing. Initially, a diamond wire saw is used to slice the ingot into thin wafers. Then, the rough surfaces of the sliced wafers are lapped to remove any imperfections and achieve the desired thickness. Finally, the wafers undergo a polishing process to achieve a smooth and mirror-like surface, which is essential for efficient solar cell production.
