How much is the thickness of the silicon wafer
And two knives. We do DIP package, 4 inch wafer to thin to 0.300mm; 6 inch wafer to be reduced to about 0.320mm, error 0.020mm.
Around 0.670mm. Wafer must be thinned, otherwise the loss of dicing knife
For integrated circuits: generally 4 inch wafer thickness of 0.520mm, the thickness of the 6 inch wafer
