How to deal with silicon wafer annealing

I would like to ask: silicon annealing treatment is how? Why anneal? Does annealing have an effect on the resistivity and the minority lifetime?

Answer:

In the straightening process due to influence of single crystal pulling process, the crystal head will produce oxygen donor, existing oxygen donors lead to artificially high P type single crystal silicon head resistivity, annealing at a temperature of 650 degrees, time to out immediately after the fan blowing, rapid cooling, the oxide layer on the surface of polished off. The resistivity of the resistivity drop test. At the same time, the annealing will decrease the lifetime of minority carriers.

Another fact: if the same "complement", can be understood as: oxygen from the surface after the removal of impurities, near the surface of the reduced defects is also reduced, the mean free path of carrier mobility increases, also increases, which leads to the decrease of resistivity.

Why anneal? One reason is that silicon contains oxygen, oxygen has the role of absorbing impurities. The oxygen near the surface of the silicon wafer can be removed from the surface during annealing, so as to reduce the number of impurities near the surface. Facilitates device fabrication;Annealing has a certain influence on the resistivity and minority lifetime.For reference.

Silicon wafer annealing process, is a part of the process. According to a certain procedure, the process of heating and cooling..;