How to solve the switching power supply MOS tube and transformer temperature rise is too high
For the secondary side of the transformer rectifier can choose more efficient synchronous rectification technology to reduce the loss. For high-frequency magnetic materials caused by the loss, to try to avoid skin effect, the effect of the skin effect, can be used to multi-stranded paint and around the way to solve.
5.2.2 switching power supply thermal design MOS tube conduction when there is a certain pressure drop, that is, the device has a certain loss, it will cause the chip temperature rise, but the device heat and heat capacity and heat dissipation conditions. As a result, the device power has a certain margin
The heat loss of the switch tube is caused by the loss. The loss of the switch tube is composed of two parts: the switching process loss and the on-state loss. The reduction of the on-state loss can reduce the on-state loss by selecting the switch with low on-resistance. The process loss is caused by the gate charge size and the switching time, which reduces the switching process loss by selecting a device with a faster switching speed and a shorter recovery time. But more importantly, through the design of better control methods and buffer technology to reduce the loss, such as the use of soft-switching technology, can greatly reduce this loss. Reduce the heat of the power diode, the AC rectifier and the buffer diode, under normal circumstances will not have better control technology to reduce the loss, you can choose high-quality diode to reduce the loss.
Switching power supply in the main components of the semiconductor switch tube, power diodes, high-frequency transformers, filter inductors and so on. Different devices have different methods of controlling calorific value. Power tube is a high-frequency switching power supply in one of the larger heat, reduce its heat, not only can improve the reliability of the power tube, and can improve the reliability of switching power supply, improve the average time between failures (MTBF)
