Is the LED Packaging Engineer demanding?
LED chip testMicroscopic examination: mechanical damage and pitting pit or material surface (lockhill chip size and electrode size, electrode pattern should comply with process requirements is complete.
LED expansionAs the LED chip is still closely spaced after dicing, the spacing is very small (about 0.1mm), which is not conducive to the operation of the subsequent process. We use the expansion machine to expand the film on the bonding chip, and the LED chip spacing is stretched to about 0.6mm. Manual expansion can also be used, but it is easy to cause chip waste, waste and other undesirable problems.
LED dispensingPlace the silver glue or insulating glue at the corresponding position of the LED bracket. For GaAs, SiC conductive substrates, red, yellow, yellow green chips with back electrodes are employed. For sapphire blue and green LED chips with sapphire insulation substrate, insulation chip is used to fix the chip
LED glue preparationThe preparation and dispensing glue is used instead, preparing the silver glue to glue machine on the back of the LED electrode, and then put back with silver colloid LED installed in the LED bracket. The efficiency of preparation is much higher than that of dispensing, but not all products are suitable for sizing process.
LED hand stabThe expansion LED chip (glue or no glue) is placed on the gripper of the thorn table, and the LED bracket is placed under the clamp, and the LED chip is stabbed one by one at the corresponding position with the needle under the microscope. Hand thorn has an advantage compared with the automatic racking, for different chips replaced at any time, suitable for the need to install a variety of chip products.
