Manufacturing process of LED device
As the LED chip is still closely spaced after dicing, the spacing is very small (about 0.1mm), which is not conducive to the operation of the subsequent process. We use the expansion machine to expand the film on the bonding chip, and the LED chip spacing is stretched to about 0.6mm. Manual expansion can also be used, but it is easy to cause chip waste, waste and other undesirable problems.
Microscopic examination: mechanical damage and pitting pit or material surface (lockhill chip size and electrode size, electrode pattern should comply with process requirements is complete.
After injecting a certain electric current, the electrons and holes flow through the PN junction or similar structural planes, and the diode semiconductor devices are spontaneously combined to produce radiation light. Subject: application of Surveying and mapping (a subject); surveying instruments (two subjects) in definition 2: semiconductor p-n junction or similar structure with forward current, semiconductor can emit visible or non visible radiation light emitting device. Applied disciplines: Mechanical Engineering (first level discipline); instrumentation components (two disciplines); display devices (three disciplines); LED manufacturing processes; from expansion to packaging
