Monocrystalline silicon processing technology
The use of more than one set of cutting lines is an innovative way to increase the output of the machine under the condition of keeping the speed. The latest MaxEdge system of applied materials company uses a unique set of two independent control cutting components.MaxEdge is the industry's first use of specially designed fine wire secant system, the minimum can reach 80 M. Compared with the HCT B5 wire system applied materials industry leading, these improvements reduce the loss of the silicon material yield up to 50%.Wire system with higher productivity can reduce the number of tools in wafer yield under the same. Therefore, manufacturers can significantly reduce the cost of equipment, operators and maintenance.Reducing the consumption of silicon wafers is directly reducing the cost per watt of solar power.Wire products marketThe silicon wafer suppliers and hope to integrate the crystalline silicon PV module manufacturers to control their own slice process requires the use of wire saw device. Monocrystalline silicon and polycrystalline silicon photovoltaic technology are needed to use it.
Wafer thickness is also a factor in productivity, as it relates to the number of wafers produced by each silicon block. The ultrathin wafer presents additional challenges to the wire technology, because the production process is much more difficult to. In addition to the mechanical brittleness of silicon wafers, if the wire sawing process no precise control, slight crack and bending will have negative effects on product yield. The system must be of ultra-thin silicon wire technology, linear cutting line speed and pressure, and precise control of cutting coolant.Regardless of the thickness of the silicon wafer, crystal silicon solar cell manufacturers have made great demands on the quality of the silicon wafer. The wafer cannot have surface damage (minor cracks, wire mark), morphology defects (bending, convex, uneven thickness) to minimize additional back-end processing such as polishing and other requirements to a minimum. Current situationIn order to meet the market for lower cost and higher productivity, a new generation of wire must improve the cutting speed, the use of silicon longer so as to improve the cutting load. Thinner cutting lines and thinner silicon chips increase productivity, while advanced process control can manage cutting line tension to keep the cutting line firm.
Cut diameterFine cutting lines mean lower kerf loss, that is to say with a piece of silicon can produce more silicon. However, the cutting line is thinner and more prone to fracture.loadThe total area of each cut is equal to the area of the wafer X the number of silicon blocks per cut X the number of chips per silicon block.Cutting speedThe cutting table cuts the speed of the web through the cutting line, which is largely determined by the cutting line moving speed, the motor power and the cutting wire tension.Easy maintenanceNeed to replace the wire cutting line and grinding slurry in cutting, maintain faster, higher overall productivity.Producers must balance these factors to maximize productivity. Higher cutting speed and greater load will increase the tension of the cutting line and increase the risk of breakage. Since all the chips on the same silicon chip are cut at the same time, as long as there is a cutting line broken, all the chips have to be discarded. However, it is not advisable to use a thicker and stronger cutting line, which reduces the number of wafers produced per cut and increases the consumption of silicon materials.
Most photovoltaic equipment suppliers buy chip wire. They generally grow silicon ingots or silicon blocks and process silicon materials into wafers, which are eventually sold to photovoltaic cell manufacturers for the production of batteries. The installed capacity of the industry's most successful application of B5 wire materials company HCT system more than 500 units, is a benchmark in the field of photovoltaic chip products nclusionIn the field of photovoltaic technology, wire reduces wafer thickness and reduce the material loss in the cutting process, thereby reducing the power consumption of the solar silicon materials. (therefore, wire saw technology to reduce the cost per watt of solar energy and eventually to achieve grid parity has played a crucial role. The latest and most advanced wire technology brings a lot of innovation, improve the productivity and the thinner silicon wafers to reduce the consumption of silicon materials.
