Polishing method for optical lenses
In the last century in 60s, the use of polishing powder application Xing Chemical mechanical polishing technology on flat silicon substrate, from the beginning of the end of the 80s, CMP used for large-scale ULSI polishing integrated circuit, the current CMP can not only ensure the high planarization requirements, but also reduce the removal amount of surface, the now popular CMP research on ultra thin membrane removal and planarization. From the development of CMP equipment, CMP machine was originally a single head work, and low efficiency, poor automation, CMP Taiwan currently has a head, can guarantee the polishing efficiency, some of the recent Japanese company also developed a linear polishing machine.
The use of polishing powder chemical mechanical polishing is a both a tan chemical polishing and mechanical polishing two advantages of the technology of [m-19}CMP process can be summarized as: in the polishing pad and polishing powder under the action of the first because of the chemical effect of polishing powder of the material surface layer is softened, then in the role of mechanical polishing powder the polishing pad, the removal of the surface of the workpiece so as to realize high-speed planarization. The whole process involves polishing machine and polishing consumables, mainly including consumables polishing powder and polishing pad, occupy about 60% o CMP chemical mechanism and polishing powder CMP of the total cost in the closely related, polishing materials affect the polishing rate and surface defects CMP.
Polishing powder is used to polish the surface of the material. The traditional materials more plane technology, such as heat flux method, etching back method, rotary glass method, electronic surround resonance method, low voltage CVD, deposition, deposition of a corrosion deposition, plasma enhanced CVD, development of these materials in planarization technology have been applied, due to local planarization technology for these technologies belong to the material, in order to achieve global planarization, use of polishing powder do chemical mechanical polishing technology began to develop gradually.
