Mainly in the application of nanotechnology materials.
PVD is a physical vapor deposition, is currently widely used in the international advanced surface treatment technology. Its working principle is in the vacuum conditions, the use of gas discharge to the gas or the evaporative material part of the ionization or evaporation of substances in the ion bombardment at the same time the evaporation or its reactants deposited on the substrate. It has the characteristics of rapid deposition and surface cleaning, especially with the film adhesion, good winding, can be widely plated and other advantages.
