Seeking for the video: manual insert silicon wafer single crystal insert method
To solve the finger print is very simple, as long as the requirements of employees can not in the whole process of operation of the silicon bare hand contact can be, no debris is not possible, but to see the machine or man-made debris or before the procedure is cracked as, if it is man-made debris, to do a a standard specification, as long as the control that would reduce the rate of fragmentation. Or artificial debris to staff assessment, but also meet the results. I used to track debris for a long time, when all of the pieces are controlled by the descendants of the debris is very low. The main road is the most hidden crack. If the semi automatic equipment under normal circumstances will not produce debris, such as automatic equipment, such as degumming equipment will produce debris, mainly the spray pressure is too large, but the pressure is also very little fragmentation of the right. I think the main thing is to see if you have asked the staff how to do it, followed by the implementation of your employees are required. You can look at these lines on the line!
After the water is put into the plug, each time the number of slices can not be more than fifty pieces, the number of chips too easy to fall damaged silicon. If the chip is not cleaned in time to allow the silicon chip in the water bubble, but the bubble can not be more than an hour
I'll tell you how to find the tab! First bring gloves put water, the water level must be submerged inserted cassette cleaning or oxidation film will not wash clean
In fact, this is very simple is not necessarily need to look at the video, the video I was there, but only a few seconds to insert the piece, there are a lot of things can not give you
