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Several kinds of circuit boards

Several kinds of circuit boards

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General printed board substrate materials can be divided into two categories: rigid substrate materials and flexible substrate materials.
In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc..
According to the different resin adhesive used in the classification, the common paper based CCI. There are: phenolic resin (XPc, XxxPC, FR 1, FR 2, etc.), epoxy resin (FE a 3), polyester resin and other types. Glass cloth CCL common epoxy resin (FR 4, FR 5), it is the most widely used type of glass fiber cloth at.
Generally used in the semi - thick plate, is the copper clad plate in the production process of semi-finished products (mostly glass cloth impregnated with resin, after drying). There are many kinds of classification methods of copper clad laminate. According to the general board reinforced with different materials can be divided into: paper base, glass fiber cloth, composite base (CEM Series), build up multilayer plate base and special material (ceramic, metal core based) five categories.
General rigid substrate material is an important variety of copper clad laminate. It is used for reinforcing material (Reinforeing Material), impregnated with resin adhesive by drying, cutting, laminating blank, and then covered with copper foil, as die steel, in the hot press with high temperature and high pressure forming process and made.

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