Solar silicon wafer cutting fluid content is polyethylene glycol, flash point 182-278 DEG C, saturated vapor pressure of 6.21KPa/20 C / C in storage in the barrel, after exposure, its volatile gas is harmful?
Silicon in a weak base and water will slowly release hydrogen
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume3, can only be used for single crystal cutting4, the cost of the problem, and now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive
Combustible gas is hydrogen is not polyethylene glycol, but no matter because of ventilation, ventilation, to avoid the closed environment in the case of an open flame on the line
