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The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?

The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?

Answer:

Electroplated diamond wireWith high tensile strength, the strength of electroplated diamond wire is more than 110% of the original strand strength. The technical problem of electroplating line embrittlement caused by plating induced tensile stress is solved successfully.
Product advantages of electroplated diamond wireCurrent line cutting methodInternal cuttingThe material utilization rate is only 40%~50%, and there are many defects, such as the wide kerf, the lower material, the poor precision of the surface shape, the depth of the surface damage layer and the size of the workpiece being machined.
Mortar free multi wire cuttingMortar free type multi wire cutting, cutting and cutting sand coexist in the grinding fluid, resulting in low cutting efficiency; and the high viscosity of the coolant and cutting sand and high value of cutting raw materials mixed together, separation is difficult, resulting in the waste of raw materials and environmental pollution.Diamond wire cuttingThe preparation technology of diamond wire belongs to the technology of consolidation abrasive particles. Fixed abrasive wire cutting way between the consolidation in the wire on the abrasive and workpiece material cutting based on the principle of two body wear, abrasive particles directly on the workpiece, which belongs to a kind of rigid cutting method, greatly improves the cutting efficiency.

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