Wafer cutting will appear thick sheet, I would like to ask what the reasons are
There is a gap between the guide bar and C. silicon block, cut after the start, with the steel wire operation, part of the guide bar is broken into wire, steel wire dislocation, because the steel line will instantly locate in the cutting process, thus causing the phenomenon of silicon chip thickness.D. guide groove wear serious. Guide for coating of polyurethane materials, cutting knife must guide groove root wear, wheel groove cutting process of cutting steel wire side, in the wheel groove due to sloshing around the lead sheet thickness.
B. cut is not set before zero. The correct method is to set the zero (in HCT machine tool as an example): crystal rod loading machine, manual reduction worktable makes four ingot guiding strips just contact wire touch screen and click on the main interface with zero button, then slow the stage to -1.5mm real position and named set zero cutting number. If the zero position is set properly, the guide bar to the contact wire, the cutting after the start of steel wire due to friction tension instability, resulting from the start to create the knife into the chip thickness.
Silicon wafer wire cutting will appear thick sheet, for the following reasons:1, the whole chip thickness:The A. guide slot is not uniform. Wafer thickness = slot steel wire diameter -4 times (SIC) D50, according to the requirements of wafer thickness required, you can calculate the best slot. In addition, because in the cutting process, steel wire wear, steel wire diameter decreases, and the port changed from round to oval, so the guide slot should be compensated according to the loss situation, to ensure the uniformity of wafer thickness.
Solving measures:A. guide slot check slot is uniform, and to compensate for the loss according to the situation of the slot wheel.When the A. is set to zero, the position of the guide line is controlled.B. standard viscose operation. When the surface of the silicon block is bonded with the guide bar, the utility model can be used to check whether the guide strip is bent, and whether the glue is evenly applied, so that there is no gap between the guide strip and the silicon block after the bonding guide strip is arranged.In the process of using the C. guide wheel, the utility model is used to detect the guide groove of the guide wheel on a regular basis, and the depth and the angle of the guide groove are observed.
