What are some of the PCB substrate materials? How to classify?
In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc..
There are many kinds of classification methods of copper clad laminate. According to the general board reinforced with different materials can be divided into: paper base, glass fiber cloth, composite base (CEM Series), build up multilayer plate base and special material (ceramic, metal core based) five categories. According to the different resin adhesive used in the classification, the common paper based CCI. There are: phenolic resin (XPc, XxxPC, FR 1, FR 2, etc.), epoxy resin (FE a 3), polyester resin and other types. Glass cloth CCL common epoxy resin (FR 4, FR 5), it is the most widely used type of glass fiber cloth at.
General printed circuit board substrate materials can be divided into two categories: rigid substrate material and flexible substrate material. General rigid substrate material is an important variety of copper clad laminate. It is used for reinforcing material (Reinforeing Material), impregnated with resin adhesive by drying, cutting, laminating blank, and then covered with copper foil, as die steel, in the hot press with high temperature and high pressure forming process and made. Generally used in the semi - thick plate, is the copper clad plate in the production process of semi-finished products (mostly glass cloth impregnated with resin, after drying).
