What are the aspects of silicon wafer testing?
Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
Silicon chips have side length 125mm, 156mm, and 125 of the large chamfer diagonal 156mm and small chamfer diagonal 165mm, polycrystalline silicon chip to the side of the 156mm based, diagonal 219.2mm.
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;
