What are the FPC flexible printed circuit board materials?
Due to the low glass transition temperature of the acrylic adhesive sheet, the large amount of contamination caused by the drilling process is not easy to remove, the quality of the metal hole, and other bonding materials are unsatisfactory. Therefore, the multilayer flexible circuit As the polyimide material, the CTE (thermal expansion coefficient) is consistent with the polyimide substrate, which overcomes the problem of dimensional instability in the multilayer flexible circuit, and the other properties are satisfactory The
polyimide substrate adhesive film with epoxy and acrylic points. Select the adhesive sheet is the main study of the material flow and thermal expansion coefficient. There is also a non-adhesive sheet of polyimide copper clad laminate, which is more resistant to chemical and electrical properties.
The effect of the adhesive sheet is to bond the film with a metal foil, or bond the film with a film (cover film). Different types of adhesive films can be used for different film substrates, such as polyester adhesive sheet and polyimide adhesive sheet is not the same,
Polyimide (PET: Polyester, trade name Mylar) film and polytetrafluoroethylene (PTFE: Ployterafluoroethylene) film are commonly used in engineering. The general film thickness is selected in the range of O.0127 to O.127 mm (O.5 to 5 mil).
As the insulating carrier of the circuit board, the choice of flexible dielectric film, requires a comprehensive study of the material heat resistance, coating performance, thickness, mechanical properties and electrical properties.
