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Question:

What is the difference between inorganic adhesive and natural adhesive?

What is the difference between inorganic adhesive and natural adhesive?

Answer:

Refer to it from the natural adhesive substances in nature. Including protein, starch, dextrin, animal glue, shellac, glue, rosin and other biological adhesive; including asphalt and other mineral binders.
The inorganic adhesive has the following characteristics: 1) high temperature, while low temperature, inorganic adhesive itself can withstand 1000 degrees Celsius or higher temperature can be improved after the inorganic glue temperature of 1800 degrees centigrade. 2) usually water soluble, low toxicity, no burning, no environmental pollution. 3) the coefficient of thermal expansion is small, only 1/10 of steel and 1/3 of ceramics. 4) resistant to oil, radiation, aging and good durability. But not acid, alkali corrosion, water resistance is poor, brittleness, and no impact. 5) can be cured at room temperature, basically do not shrink, and some are slightly inflated. 6) the connection and groove bonding strength is high, should not be flat. The tensile shear strength of the jacket is greater than 100MPa. 7) inorganic glue is mostly a mixture of solid and liquid. The material is easy to obtain, low in price and convenient to use.
Some people have soaked inorganic adhesive articles into liquid oxygen at -186 degrees Celsius, and the bonding effect has not changed. An inorganic phosphate of copper oxide, consisting mainly of aluminum phosphate solution and copper oxide powder. The adhesive on the surface, will become very rough, a zigzag state, it will make the tensile strength of goods than the plane items 3-5 times higher. Inorganic adhesives are used for bonding rockets, spacecraft parts, bonding of cryogenic surgical instruments, bonding of automobiles and ships engines, bonding and mending of parts of oxygen generators, etc..
Inorganic adhesive: a general organic adhesive that can withstand high temperatures, usually below 100 degrees celsius. Such as latex at 60 degrees below, epoxy resin at about 100, phenolic resin at about 220 degrees celsius. The inorganic adhesive can withstand the high temperature of 600 - 900 degrees Celsius, and improve the composition after more than 1800 degrees celsius.

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