What materials are needed in PCB plant?
According to the classification of CCL flame retardant performance, can be divided into flame retardant (UL94 a VO, UL94 a V1 class) and non flame retardant (UL94 a HB) two kinds of board. In the past one or two years, with the more attention to the environmental protection problem, a new kind of bromine free CCL variety, which is a new type of flame retardant CCL, can be called "green flame retardant cCL". With the rapid development of electronic technology, cCL has higher performance requirements. Therefore, from the performance of the CCL classification, is divided into the general performance of CCL, low dielectric constant CCL, high heat resistance of the CCL (general board of L above 150 degrees Celsius), low thermal expansion coefficient of CCL (commonly used for packaging substrate) and other types
There are many kinds of classification methods of copper clad laminate. According to the general board reinforced with different materials can be divided into: paper base, glass fiber cloth, composite base (CEM Series), build up multilayer plate base and special material (ceramic, metal core based) five categories. According to the different resin adhesive used in the classification, the common paper based CCI. There are: phenolic resin (XPc, XxxPC, FR 1, FR 2, etc.), epoxy resin (FE a 3), polyester resin and other types. Glass cloth CCL common epoxy resin (FR 4, FR 5), it is the most widely used type of glass fiber cloth at. In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc..
General rigid substrate material is an important variety of copper clad laminate. It is used for reinforcing material (Reinforeing Material), impregnated with resin adhesive by drying, cutting, laminating blank, and then covered with copper foil, as die steel, in the hot press with high temperature and high pressure forming process and made. Generally used in the semi - thick plate, is the copper clad plate in the production process of semi-finished products (mostly glass cloth impregnated with resin, after drying).
