Why do monocrystalline silicon chamfer? Polysilicon film?
Chamfering is for this purpose, grinding and polishing are also for this purpose. As a single crystal practitioners, it is recommended that you take a look at the processing technology of silicon single crystal wafer > this book, written by Zhang Juezong, more comprehensive
After the wafer after cutting edge surface with corners burr edge collapse even cracks or other defects, the edge of rough surface. In order to increase the mechanical strength of silicon slice edge surface, reduce particle pollution, will be the edge grinding in a circular arc shape or a trapezoid
There are many single crystal chamfer.Single crystals are generally large chamfer, there is a single crystal process decision. There is a single crystal silicon rod is cut out, in order to make full use of the silicon rod, appear large chamfer; and polycrystalline is generally small chamfer, is to reduce the crack edge of the silicon wafer, the external stress of the silicon wafer or cell rupture. Polycrystalline battery will also appear large chamfer, those are generally small chamfer of the battery, found that there is a problem after the cut into large chamfer.
