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Comparison of semiconductor refrigeration technology and compressor refrigeration technology

Comparison of semiconductor refrigeration technology and compressor refrigeration technology

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Semiconductor refrigeration:The utility model has the advantages of small noise, small size and environmental protectionDisadvantages: refrigeration temperature difference is not high, the general temperature difference of 50~60 degreesCompressor refrigeration:Advantages: refrigeration effect is good, the temperature difference can reach more than 10 degreesDisadvantages: large noise, large size, not too green
Semiconductor refrigeration technology is not very mature, things are good, but the effect is not good, there is no way to improve it
The utility model relates to a semiconductor practical small power refrigerating machine, and a practical high-power refrigerating machine for compressors
Mechanical compression refrigeration system includes compressor, condenser, filter, solenoid valve, expansion valve, evaporator, liquid storage, refrigerant and so on, through the pipeline to link each component.Compressor refrigeration defects:Low temperature start difficult, winter heating efficiency is low, afraid of vibration, can not tilt, but also can not be arbitrarily reversed. System operation requires explosive operation to replace damaged components. In the event of damage to components and pipelines, the refrigerant must be released to initiate the operation, which is a waste.Compressor refrigeration advantages:High refrigeration efficiency, COP maximum can reach 3.8., energy saving and environmental protection.The semiconductor air conditioner is composed of a semiconductor refrigerating plate, a cooling film and a radiating fin, etc. the semiconductor air conditioner is connected by a cable.Disadvantages of semiconductor refrigeration:Refrigeration efficiency is low, the maximum can reach 0.6. The cooling performance varies nonlinearly with the ambient temperature, voltage, lead block thickness, cold end heat dissipation mode, mechanical pressure, thermal conductivity, phase change material, and so on.

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