copper clad, how do you copper laminate plastics and fiberglass for use as a pcb?
For multi-layer PCBs, you use 2-sided copper laminate with the fiberglass resin material in between the copper sheets. The layer in between the facing copper sheets of 2 laminates (for a 4-layer board) is the same material that is used between the double-layer laminate material -- called pre-preg. Each 2-layer board is etched with the conductive pattern of copper (wires and pads for components), then the pre-preg material is added between 2-layer boards to make a 4-layer, or 6-layer, or 8-layer, etc. PC board. The layers are, indeed, held together by adhesive that is pressure activated. After all the layers are stacked up and glued together the holes are drilled for the components, the hardware and the vias. The component holes and vias (holes that connect one layer to another layer) are electroplated with copper to make the electrical connections. The PCB is tested for short circuits and open circuits (if required) and then coated with solder mask and artwork (component numbers, serial numbers, logos, etc.). .
To make PCBs they don't just use any old plastic. They're high-tech engineered materials. Circuit boards are usually made from sheets of partially cured resin-impregnated fiberglass with copper already bonded to it; the undesired copper is etched away. These are laminated together with more sheets of plain fiberglass. The copper starts as foil with surface treatments to increase adhesion to the fiberglass.
not too knowledgeable in this area, but I think you take a thin sheet of copper foil, 1 mil thick or so, and glue it under pressure to the fiberglass. usually with another copper layer on the other side of the fiberglass. Most PC boards are made of 4 layers of copper. Two boards are made as above, then etched to get the final pattern. They are glued with a thin piece of fiberglass in between, again under pressure. Last one I worked on was 6 layers, with the signal layers 1/2 mill copper and the power layers 2 mil copper. size was 10 by 14 inch, and there were over 200 ICs as well as a lot of analog components.
