In addition to the commonly used DBC, what are the processes of ceramic CCL?
But this technology can not pass through holes, poor accuracy, flatness (surface roughness) is low. It is suitable to be installed on the products with large spacing, not in the precision industry. Nowadays, people's living standard is higher and higher, and the quality of products is getting higher and higher. The manufacturer of the DBC process on the market has the Milky way of Shandong in Zibo
That's the DBC technology you mentioned. Copper layer thickness, processing fast, cheap, you can make multi-storey, suitable for large-scale production.
DPC technology, which uses vacuum sputtering to copper plating, is a step closer to other processes. The utility model has the advantages of high precision, good flatness and good combining force (relative range of use), and can pass through holes.The disadvantage is that this technology can only produce thin sheet (thickness of 300 m), and its higher cost, limited production, resulting in regular shipping time is not in time. Currently on the market the use of this technique in Taiwan Tongxin
With unlimited potential LAM technology is replacing the DPC.DBC technology step by step, in the near future will occupy a certain market force, its excellent thermal conductivity. The expansion coefficient more, more firmly. The metal layer film lower resistance, and excellent weldability, the temperature is high, the main can be customized according to the customer (1 M-1 mm). In this process will not be used in electroplating, chemical plating process such as this, will not exhaust pollutants, to achieve an environmental indicators, so that environmental protection storm can no longer blow your company. Currently, only three percent of them are doing it.
