PCB board material how to identify
The so-called FR4 and CEM refers to the difference between the resin and the filler, regardless of the copper foil. You can look at the PCB drawings or ask the supplier on the line! CEM is a bit brittle and easy to sack
PCB board material identification, can be carried out from the following four aspects:
(1) dimensional stability
In addition to pay attention to X, Y axis (fiber direction and horizontal direction), but also pay attention to the Z axis (plate thickness direction), due to thermal expansion and contraction and heating reduction factors easily lead to silver plastic conductor fracture.
(2) electrical and water absorption
FR-1 is better than FR-1 and XPC in terms of dimensional safety, electrical and water absorption, so that the insulation of the insulator in the absorbent state is reduced, so that the metal is moved under the potential difference. Production of silver through-hole printed circuit board, to use special FR-1 and XPC paper substrate.
(3) ductility
Copper plating through the copper hole is a continuous crystal, there is a very good ductility, not like silver, carbon ink in the thermal expansion and contraction, easy to interface separation and reduce the conductivity.
(4) migration
Silver and copper are metal materials, easy to oxidize and restore the phenomenon caused by rust and migration phenomenon, due to the difference in potential, silver than copper in the potential difference between the trend of prone to silver migration (Silver Migration).
Circuit board name: circuit boards, PCB board, aluminum plate, high frequency board, thick copper plate, impedance board, PCB, ultra-thin circuit boards, ultra-thin circuit boards, printing (copper etching technology) circuit boards. The circuit board makes the circuit miniaturized and intuitive, which plays an important role in the mass production and optimization of the fixed circuit.
