The manual is 63/37 260 welding tin furnace temperature after other joints are not only full of gun patch due to the cost of tin is used disposable flux please analyze the reasons in detail a bit if there is a better solution
Answer: should consider the surface of the piece of foreign body and oxidation. For example, the patch surface has a very thin green, to be seen by the naked eye, because you have not said the specific circumstances of the circuit board is clear, such as double-sided board or single panel, surface treatment is gold or tin or rosin or antioxidant, observed how to face abnormal, can't give you a general direction, please do well. We are the circuit board dry process team, willing to share your.
The reason is that the PCB chip pad oxide, and flux in BG lead to remove the oxide film on the tin side, Fu Xinda technology to provide professional hand dipped flux samples for your test!
The reason is that the PCB pad is oxidized, while the removal of the oxide film BG in the soldering flux results in poor tin plating.Flux: flux, solder paste and also, there are two kinds of liquid, in metallurgy is clean in a chemically welded metal surface for soldering, brazing or welding material, positioning. The use of different metal welding flux is also different, for example: the use of ammonium chloride or rosin soldering; welding galvanized iron and other zinc surface material with hydrochloric acid or zinc chloride; copper brazing or welding to black metal with borax. The welding material is easy to adhere to the corresponding welding metal surface after melting at high temperature, but the metal surface is easy to form oxide layer at high temperature, so that the welding material is difficult to adhere to the surface. The flux is stable at room temperature and has a strong reducibility at high temperatures. It can remove the oxide layer on the metal surface. In addition, the solder in soldering and brazing process can also play the role of wetting agent.
