What are the ceramic clad copper plates in addition to the DBC process?
Ceramic laminate English referred to as DBC, is composed of a ceramic substrate, bonding adhesive layer and a conductive layer formed, it refers to the copper foil at high temperature directly bonded to aluminum oxide or aluminum nitride ceramic substrate on the surface of special processing method, which has the characteristics of high thermal conductivity, high adhesion strength, excellent solderability and excellent electrical insulation properties, but not through holes, poor accuracy, surface roughness, the linewidth is only applicable to space of the place, not precise place, and can only be unable to realize the mass production of small scale production.
Now the production of ceramic industry has LAM Technology (Copper Metallization Technology of laser rapid activation) to replace DBC technology, thermal conductivity ceramic circuit board produced by this new technology has better rate, stronger resistance lower metal film, more, thermal expansion coefficient, and substrate and good solderability, use temperature high, low loss at high frequency, and high density, the copper layer not containing oxide layer containing no organic ingredients, good insulation properties, conductive layer thickness can be customized according to customer requirements, between 1 M-1 mm, the most important is the 2D and 3D can be achieved
