What is a silicon wafer for unidirectional and bidirectional cutting? What is the difference between the two?
Bidirectional cutting line cutting, (1) from the line wheel line network and enter the waste wire wheel (2) after a certain length reverse line wheel released by the waste reverse into the line network into the line wheel (3) repeat from the line wheel into the wire and into the process of waste wire wheelBut the length of 1 is greater than 2
The cutting line is cut in one direction, and the wire is cut into the waste wire wheel from the discharge wheel
One way and two way cutting of silicon wafer is the two way to cut silicon ingot by using solar energy cutting wire.When slicing machine uses solar cutting line to cut silicon ingot,
