Silicon is an important material in the IC fabrication, through photolithography and ion implantation on the silicon wafer and other means, can be made into various semiconductor devices made of silicon chip. With amazing computational capabilities. The development of science and technology promotes the development of semiconductor. Development of automation and computer technology, this makes the silicon chip (integrated circuit) high technology product cost has been reduced to a very low degree. This makes the silicon wafer has been widely used in aerospace, industry, agriculture and national defense, and even crept into every family.
Is usually used in high-end IC and special IC, such as Si on insulator (SOI) wafer. In the production process of IC, need some wafer to test the status of the production process, such as the level of particle, the etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used with normal production batch process together to test the quality condition of a process, such as the CVD film thickness. In the production equipment maintenance or repair, immediately production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, which is usually called wafer dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as machine must wafer to process a number of problems with dummy wafer complement, and some machines must be in the process of a certain number of wafer A form of dummy run, otherwise the process can not guarantee the quality and so on many wafer and so on can be called dummy. block basically can be regarded as a kind of.Dummy wafer dummy, wafer control chip, a guard sheet usually can be recycled.
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer was produced. Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough within wafer doping some impurities, such as P, B etc.
