What is the optimum ultrasonic frequency for ultrasonic cleaning of silicon wafers?
If it is silicon material cleaning, you can use 25-28KHZ directly. This kind of low frequency ultrasonic power is more powerful. If the thin silicon wafer has to be 80-120KHZ. The frequency selection is based on the size of the particles to be processed on the wafer
The bottom wall of the frame is made of fence like quartz bars, and the whole frame is supported by the support feet in the cleaning tank. The present invention changed the vertical level of ultra ultra washing after washing solution, because the distance of ultrasonic ranging from silicon source pollutants easily accumulate in the surface of a silicon wafer is caused by a local difficult clean problem and eliminate the made of PTFE material bearing silicon adsorption and blocking software basket will transfer the ultrasonic source, resulting in local area of silicon wafer surface cleaning the phenomenon is not clean.
Ultrasonic cleaning machine of silicon wafer method and its device will be washing method is placed in the bottom horizontal grinding silicon wafer cleaning groove above the fence shaped quartz rod frame, in order to ensure the cleaning tank with deionized water height and the constant flow conditions, cleaning by ultrasonic vibrator is arranged on the bottom of the cleaning tank, the ultrasonic frequency is 40KHz. 80KHZ, every 5 minutes will turn a grinding silicon wafer surface grinding of silicon surface to be super super continuous wash wash no black smoke pollutants check.
