What is the printed circuit board workflow
Sided copper cladding → cutting → stacking → CNC drilling through hole → inspection, deburring brushing → electroless plating (via hole metallization) → (full plate plating thin copper) → inspection brushing → screen printing negative circuit graphics , Corrosion (dry film or wet film, exposure, development) → inspection, repair plate → line pattern plating → electroplating tin (corrosion nickel / gold) → to the printing material (photosensitive film) → etching copper → (tin) Scrubbing → printing, heat-curing, commonly used photosensitive heat-curing green oil) → cleaning, drying → screen printing mark character graphics, curing → (spray Tin or organic solder film) → shape processing → cleaning, drying → electrical on-off detection → inspection packaging → finished products factory
UV curing → preheating, punching and shape → electrical open, short circuit test → scrubbing, drying → pre-coated welding antioxidant (dry ) Or spray hot hot air leveling → inspection packaging → finished products factory.
Single-sided copper cladding → cutting → (brushing, drying) → drilling or punching → screen printing line anti-etching pattern or using dry film → curing inspection plate → etching copper → anti-corrosion printing, drying → scrubbing, drying → screen printing (common green oil), UV curing → screen printing character marking graphics,
