How is the silicon chip integrated circuit?
Description: the above process is only an example. The name of the process, in the name of different manufacturers have different. But roughly so. There are some differences between the process of MOS circuit and.
The following procedures: scribing - sintering base - bonding - in - Test - Packaging - aging - testing - printing (laser or screen printing)
Based on TTL series integrated circuit as an example, from silicon to process integrated circuit: cut off from a monocrystalline silicon chip, polished - polishing - oxidation - lithography - diffusion - epitaxial buried layer - oxidation - oxidation - diffusion - isolation lithography lithography - base diffusion - oxidation lithography - emitter diffusion vacuum aluminizing - sintering (ohmic contact lithography) - at the initial test procedure is done.
