What are chip analysis instruments and methods?
XRay (both of which are non destructive analysis means failure after the first use of chip Feinfocus, Germany)Micro Xray application: semiconductor BGA, analysis of circuit board internal displacement; to distinguish air welding, weld and welding defects. BGA parameters: the standard detection resolution is less than 500 nm; geometric magnification: 2000 times the maximum magnification: 10000 times per hour; radiation is small: less than 1 Sv; voltage: 160 KV open tube designAnti-collision design; BGA and SMT (QFP) automatic analysis software, gap calculation software, common defect automatic identification software and video recording. These features are well suited for a variety of two-dimensional and three-dimensional micro focus computed tomography (CT) applications.
Probe Station /Probing Test probe probe test, ESD/Latch-up electrostatic discharge / latch test utility (some customers are on the two reliability test, before the chip into the client some customers is failure to think about to take good test piece to screen these) has been put to the most commonly used means. There are some necessary analysis before the process of samples, the failure of die, decap (open, open cap), grinding, ball to De-gold bump, go to the layer, such as coloring, some also need the corresponding instrument machine, you can view the die SEM SAM and X Ray surface, look inside the package and delamination failure.In addition to the commonly used means other failure analysis methods, atomic force microscopy AFM, SIMS two ion mass spectrometry, time-of-flight mass spectrometry TOF SIMS TEM, transmission electron microscopy, field emission scanning electron microscopy, field emission scanning auger microprobe, X photoelectron spectroscopy XPS, L-I-V test system, the energy loss of X optical micro analysis system and many other means however, these projects are not very common.
C-SAM (ultrasonic scanning microscope), nondestructive examination: 1.. The lattice structure inside the material, impurity particles, inclusions, precipitates,.2., internal cracks, 3. delamination defects,.4. voids, bubbles, voids, etc. Germany
