What is a high-density interconnect circuit board (HDI)
What is high density printed circuit board? Is a high power density inverter (High Density Inverter) abbreviation, the use of micro-blind buried hole technology, a relatively high density distribution of telephone boards. Is a compact product designed for small capacity users. It uses a modular parallel design, a module capacity of 1000VA (height 1U), natural cooling, can be directly into the 19 "rack, the largest parallel 6 modules.
Through the wire connected, you can form an electronic signal link and should be functional. Thus, a printed circuit board is a platform that provides a component connection to cover the basis of the associated part.
n the final product, it will be installed on the integrated circuit, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and other various electronic components.
