What is the difference between them and ordinary double panels?
Common printed circuit boards are made of low-end materials, such as: paper substrate, composite substrate, epoxy board (also known as 3240 epoxy board, phenolic board), FR-4 glass fiber board (puzzle plate)
It is modular in parallel design, a module capacity of 1000VA (height 1U), natural cooling, can be directly into the 19 "rack, the largest parallel 6 modules. The product uses all-digital signal process control (DSP) technology and more
HDI board is a high power density inverter (High Density Inverter), the use of micro-blind buried hole technology, a relatively high density distribution of telephone boards.
Patented technology, with a full range of load capacity and strong short-term overload capacity.
