There are primarily two manufacturing processes for solar silicon wafers: the Czochralski (CZ) process and the Float-zone (FZ) process. In the CZ process, a silicon seed crystal is dipped into a molten silicon melt, and as it is slowly pulled out, a single crystal ingot is formed. This ingot is then sliced into thin wafers.
On the other hand, the FZ process involves melting a silicon rod from one end and slowly solidifying it in a controlled manner. This results in a single crystal silicon rod that can be sliced into wafers.
Both processes produce high-quality silicon wafers, but the CZ process is more commonly used due to its higher productivity and lower cost.
There are mainly two manufacturing processes for solar silicon wafers: the Czochralski (CZ) process and the Float Zone (FZ) process. In the CZ process, a silicon crystal is grown from a molten silicon melt using a seed crystal, which is then sliced into wafers. The FZ process involves slowly pulling a silicon crystal through a molten zone, creating a solid silicon cylinder that is then sliced into wafers. Both processes require further steps such as wafer polishing and cleaning to produce high-quality solar silicon wafers.
The different manufacturing processes for solar silicon wafers include crystallization, wafering, texturization, doping, passivation, and metallization.
