How to make copper clad laminate?
It is the key material for making copper clad laminate. It must have high conductivity and good weldability. Requirements of copper foil surface should not have scratches, blisters and wrinkles, metal purity not less than 99.8%, the thickness error is no more than 5um. According to the standards issued by the Ministry, the nominal series of copper foil thickness are 18, 25, 35, 70 and 105um. Copper foil with 35um thickness is being popularized step by step in our country. The thinner the copper foil, the easier it is to etch and drill holes, particularly suited for the manufacture of complex, high-density printed boards.
An insulating laminate composed of polymers, synthetic resins, and reinforcing materials can be used as a substrate for copper clad laminates. A wide variety of synthetic resins, commonly used phenolic resin, epoxy resin, PTFE and so on. Reinforced materials generally have two kinds of paper and cloth, which determines the mechanical properties of the substrate, such as solder resistance, flexural strength etc..
Copper clad laminate is a bonding process and a hot extrusion process, so that a certain thickness of copper foil is firmly covered on the insulating substrate. The copper clad laminates used are different in material and thickness.Copper-clad copper foil and adhesive are also different, copper produced by the performance of copper on a very different
